GRGT yana ba da bincike mai ɓarna jiki (DPA) na abubuwan da ke rufe abubuwan da ba a iya gani ba, na'urori masu hankali da haɗaɗɗun da'irori.
Don ci-gaban matakai na semiconductor, damar DPA tana rufe kwakwalwan kwamfuta da ke ƙasa 7nm, matsalolin za a iya kulle su a cikin takamaiman guntu Layer ko kewayon um;don matakan hatimi na matakin sararin samaniya tare da buƙatun kula da tururin ruwa, za a iya yin nazarin abun da ke cikin tururi na matakin PPM don tabbatar da buƙatun amfani na musamman na abubuwan rufewar iska.
Haɗaɗɗen kwakwalwan kwamfuta, kayan lantarki, na'urori masu hankali, na'urorin lantarki, igiyoyi da masu haɗawa, microprocessors, na'urorin dabaru masu shirye-shirye, ƙwaƙwalwar ajiya, AD/DA, musaya na bas, da'irori na dijital gabaɗaya, na'urorin analog, na'urorin analog, na'urorin microwave, kayan wuta, da sauransu.
GJB128A-97 Hanyar gwajin na'urar Semiconductor mai hankali
● GJB360A-96 hanyar gwajin kayan lantarki da na lantarki
● GJB548B-2005 Hanyoyin gwajin na'urar microelectronic da hanyoyin
● GJB7243-2011 Bukatun Fasaha na Nuna don Kayan Kayan Wuta na Soja
● GJB40247A-2006 Hanyar Nazarin Jiki Mai Ruɓa don Abubuwan Lantarki na Soja
QJ10003-2008 Jagorar Nuna don Abubuwan da Aka Shigo
● MIL-STD-750D semiconductor discrete na'urar gwajin Hanyar
● MIL-STD-883G hanyoyin gwajin na'urar microelectronic da hanyoyin
Nau'in gwaji | Gwaji abubuwa |
Abubuwa marasa lalacewa | Duban gani na waje, duban X-ray, PIND, hatimi, ƙarfin tasha, duban na'ura mai ƙima |
Abu mai lalacewa | Laser de-capsulation, sinadarai e-capsulation, na ciki gas abun da ke ciki analysis, ciki na gani dubawa, SEM dubawa, bonding ƙarfi, ƙarfi ƙarfi, m ƙarfi, guntu delamination, substrate dubawa, PN junction rini, DB FIB, zafi spots, yayyo matsayi ganowa, gano rami, gwajin ESD |